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Company candidate AI networking and interconnect
삼성전기
Company candidate009150.KS Korea Exchange 기판(IC substrate) Needs review before full record
Emerging theme Advanced packaging 90
CoWoS and advanced packaging capacity
Emerging themePackaging capacity links logic dies, HBM stacks, interposers, substrates, and OSAT suppliers into one bottleneck map.
Emerging theme Next-gen substrate 78
Glass core substrates
Emerging themeGlass substrates are being watched as a way to scale package size, thermal control, and interconnect density.